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Volumn 66, Issue 8, 2012, Pages 582-585

Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging

Author keywords

Ag nanoparticle paste; Electronic packaging; Pressureless bonding; Sintering

Indexed keywords

AG NANOPARTICLE; BONDING MATERIALS; BONDING PRESSURE; BONDING PROCESS; ELECTRONIC PACKAGING; HIGH CONCENTRATION; JOINT STRENGTH; NANOSCALE LAYERS; POLY VINYL PYRROLIDONE; PRESSURELESS;

EID: 84862795179     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2012.01.007     Document Type: Article
Times cited : (203)

References (19)
  • 19
    • 0037073941 scopus 로고    scopus 로고
    • Y. Sun, and Y. Xia Science 298 2002 2176 2179
    • (2002) Science , vol.298 , pp. 2176-2179
    • Sun, Y.1    Xia, Y.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.