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Volumn 66, Issue 8, 2012, Pages 582-585
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Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging
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Author keywords
Ag nanoparticle paste; Electronic packaging; Pressureless bonding; Sintering
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Indexed keywords
AG NANOPARTICLE;
BONDING MATERIALS;
BONDING PRESSURE;
BONDING PROCESS;
ELECTRONIC PACKAGING;
HIGH CONCENTRATION;
JOINT STRENGTH;
NANOSCALE LAYERS;
POLY VINYL PYRROLIDONE;
PRESSURELESS;
COALESCENCE;
ELECTRONICS PACKAGING;
NANOPARTICLES;
SINTERING;
SILVER;
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EID: 84862795179
PISSN: 13596462
EISSN: None
Source Type: Journal
DOI: 10.1016/j.scriptamat.2012.01.007 Document Type: Article |
Times cited : (203)
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References (19)
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