Silver nanosintering: A lead-free alternative to soldering

Applied Physics A: Materials Science and Processing

Volumn 93, Issue 2, 2008, Pages 467-470

  Maruyama, Minoru ^a   Matsubayashi, Ryo ^b   Iwakuro, Hiroaki ^b   Isoda, Seiji ^c   Komatsu, Teruo ^a  

^a Osaka Prefecture University   (Japan)

^b Shindengen Electric Manufacturing Co Ltd   (Japan)

^c KYOTO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COPPER; DIODES; ORGANIC POLYMERS; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SOLDERING; THERMODYNAMIC PROPERTIES; WELDING;

ALKOXIDE; LEAD-FREE; SOLDER JOINTS;

LEAD;

EID: 51649090845     PISSN: 09478396     EISSN: 14320630     Source Type: Journal    
DOI: 10.1007/s00339-008-4807-5     Document Type: Article

References (11)

1. S.L. Lai, J.Y. Guo, V. Petrova, G. Ramanath, L.H. Allen, Phys. Rev. Lett. 77, 99 (1996)
2. S.J. Zhao, S.Q. Wang, D.Y. Cheng, H.Q. Ye, J. Phys. Chem. B 105, 12857 (2001)
3. W.D. Kingery, J. Appl. Phys. 30, 301 (1959)
4. E. Ide, S. Angata, A. Hirose, K.F. Kobayashi, Acta Mater. 53, 2385 (2005)
5. T. Wang, X. Chen, G.Q. Lu, G.Y. Lei, J. Electron. Mater. 36, 1333 (2007)
6. K.S. Moon, H. Dong, R. Maric, S. Pothukuchi, A. Hunt, Y. Li, C.P. Wong, J. Electron. Mater. 34, 168 (2005)
7. S. Kim, J. Kim, J. Lim, M. Choi, S. Kang, Appl. Phys. Lett. 91, 143117 (2007)
8. F.P. McCluskey, M. Dash, Z. Wang, D. Huff, Microelectron. Reliab. 46, 1910 (2006)
9. K.J. Puttlitz, G.T. Galyon, J. Mater. Sci. Mater. Electron. 18, 347 (2007)
10. L.H. Liang, C.M. Shen, S.X. Du, W.M. Liu, X.C. Xie, H.J. Gao, Phys. Rev. B 70, 205419 (2004)
11. H. Ogura, M. Maruyama, T. Komatsu, H. Nagasawa, A. Ichimura, T. Ogawa, S. Isoda (2008, to be published)