Simplification of low-temperature sintering nanosilver for power electronics packaging

Journal of Electronic Materials

Volumn 42, Issue 6, 2013, Pages 1209-1218

  Mei, Yunhui ^a   Chen, Gang ^a   Cao, Yunjiao ^a   Li, Xin ^a   Han, Dan ^a   Chen, Xu ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

electronic packaging; microstructures; Nanosilver; pressure assisted; shear strength; sintering

Indexed keywords

COHESIVE FAILURES; ELECTRONIC PACKAGING; LOW-TEMPERATURE SINTERING; NANO SILVER; NANO-SILVER PASTES; PRESSURE-ASSISTED; SEMICONDUCTOR CHIPS; SINTERING TEMPERATURES;

DUCTILE FRACTURE; ELECTRONICS PACKAGING; MICROSTRUCTURE; POWER ELECTRONICS; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SILVER; TEMPERATURE;

SINTERING;

EID: 84877757900     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-013-2561-8     Document Type: Article

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