Evolution of shear strength and microstructure of die bonding technologies for high temperature applications during thermal aging

2010 12th Electronics Packaging Technology Conference, EPTC 2010

Volumn , Issue , 2010, Pages 660-667

  Egelkraut, S ^a   Frey, L ^a   Knoerr, M ^b   Schletz, A ^b  

^a UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

^b FRAUNHOFER INSTITUTE FOR INTEGRATED SYSTEMS AND DEVICE TECHNOLOGY IISB   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AFTER HIGH TEMPERATURE; AIRCRAFT APPLICATIONS; DIE ATTACHMENT; DIE BONDING; EVOLUTION OF THE MICROSTRUCTURE; HIGH TEMPERATURE; HIGH TEMPERATURE STORAGE; HIGH-POWER; INTERFACIAL MICROSTRUCTURE; JUNCTION TEMPERATURES; LEAD-TIN; LOW-TEMPERATURE SINTERING; OPERATION TEMPERATURE; POWER DENSITIES; REDUCED COMPLEXITY; SCANNING ELECTRON MICROSCOPES; SHEAR FORCE; SHEAR TESTS; SILVER-NANOPARTICLES; SOLDER JOINTS; STORAGE TIME; TEST DEVICE; THEORETICAL LIMITS; THERMAL MANAGEMENT SYSTEMS; WIDE BAND GAP; WIDE BAND-GAP MATERIAL; WORK FOCUS; ZINC-ALUMINUM;

AUTOMOBILE ELECTRONIC EQUIPMENT; DIES; ELECTRONICS PACKAGING; ENERGY GAP; GERMANIUM; GERMANIUM ALLOYS; MECHANICAL STABILITY; MICROSTRUCTURE; POWER CONVERTERS; POWER ELECTRONICS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON COMPOUNDS; SHEAR STRENGTH; SILVER; SINTERING; SOLDERING ALLOYS; STORAGE (MATERIALS); TECHNOLOGY; THERMAL AGING; TIN;

HIGH TEMPERATURE APPLICATIONS;

EID: 79951917319     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2010.5702721     Document Type: Conference Paper

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