Die attach materials for high temperature applications: A review

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 4, 2011, Pages 457-478

  Manikam, V R ^a   Cheong, Kuan Yew ^a  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

Author keywords

Die attach; high temperature; power devices; wide band gap semiconductors

Indexed keywords

AEROSPACE AND AUTOMOTIVE INDUSTRIES; DIE-ATTACH; HIGH TEMPERATURE; HIGH-TEMPERATURE CAPABILITY; HIGH-TEMPERATURE DIE-ATTACH; INTERCONNECT TECHNOLOGY; POWER DEVICES; WIDE-BAND-GAP SEMICONDUCTOR;

AUTOMOTIVE INDUSTRY; ENERGY GAP; HIGH TEMPERATURE APPLICATIONS; SILICON CARBIDE;

ELECTRON DEVICES;

EID: 84455164156     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2010.2100432     Document Type: Review

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