SCOPUS 정보 검색 플랫폼

Volumn 41, Issue 7, 2012, Pages 1924-1930

Improvement of bondability by depressing the inhomogeneous distribution of nanoparticles in a sintering bonding process with silver nanoparticles

(6) Yan, Jianfeng a Zou, Guisheng a Wu, Aiping a Ren, Jialie a Hu, Anming b Zhou, Y Norman a,b

a TSINGHUA UNIVERSITY (China)

b UNIVERSITY OF WATERLOO (Canada)

Author keywords

Ag nanoparticles; bondability; coffee ring effect; electronic packaging

Indexed keywords

AG NANOPARTICLE; BONDABILITY; BONDING MATERIALS; BONDING PROCESS; BONDING TECHNIQUES; BONDING TEMPERATURES; COFFEE-RING EFFECT; ELECTRONIC PACKAGING; ELECTRONIC PACKAGING INDUSTRY; INHOMOGENEOUS DISTRIBUTION; LEAD-FREE; LOW TEMPERATURE BONDING; MARANGONI FLOWS; POLYOL METHODS; SHEAR STRENGTH OF JOINT; SILVER NANOPARTICLES;

ALCOHOLS; BONDING; ELECTRONICS PACKAGING; NANOPARTICLES; SINTERING; SOLDERED JOINTS;

SILVER;

EID: 84862787682 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-012-1965-1 Document Type: Article

Times cited : (28)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.