Low-temperature sintering of nanoscale silver paste for attaching large-area (>100 mm2) chips

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 1, 2010, Pages 98-104

  Lei, Thomas Guangyin ^a   Calata, Jesus Noel ^a   Lu, Guo Quan ^a   Chen, Xu ^b   Luo, Shufang ^c  

^a State University   (United States)

^b TIANJIN UNIVERSITY   (China)

^c NBE Technologies   (United States)

Author keywords

High temperature electronics packaging; Large area semiconductor devices; Low temperature sintering; Nanoscale silver paste

Indexed keywords

APPLIED PRESSURE; ATOMIC DIFFUSIONS; COPPER METALLIZATION; HIGH RELIABILITY; HIGH-TEMPERATURE ELECTRONICS; HIGH-TEMPERATURE ELECTRONICS PACKAGING; HIGHER JUNCTION TEMPERATURES; LARGE CHIPS; LEAD FREE SOLDERS; LOW PRESSURES; LOW-TEMPERATURE SINTERING; MELTING AND SOLIDIFICATION; MELTING TEMPERATURES; NANOMATERIAL; NANOSCALE SILVER PASTE; POWER DEVICES; PROCESSING TEMPERATURE; REFLOW TECHNIQUE; SEMICONDUCTOR CHIPS; SINTERED JOINT; SOLDER ALLOYS; SOLDERING PROCESS; SOLDERING TEMPERATURE; UNIFORM MICROSTRUCTURE;

ACOUSTIC IMAGING; ELECTRONIC EQUIPMENT MANUFACTURE; FLIP CHIP DEVICES; LEAD; NANOSTRUCTURED MATERIALS; ORGANIC POLYMERS; POWER ELECTRONICS; PROCESSING; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR SWITCHES; SILVER; SILVER ALLOYS; SINTERING; SOLDERING; SOLDERING ALLOYS;

CHIP SCALE PACKAGES;

EID: 77949570776     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2021256     Document Type: Article

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