SCOPUS 정보 검색 플랫폼

Journal of Materials Chemistry

Volumn 21, Issue 40, 2011, Pages 15981-15986

Preparation of PVP coated Cu NPs and the application for low-temperature bonding

(4) Jianfeng, Yan a Guisheng, Zou a Anming, Hu b Zhou, Y Norman b

a TSINGHUA UNIVERSITY (China)

b UNIVERSITY OF WATERLOO (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

AG NANOPARTICLE; BONDING PROCESS; CU NANOPARTICLES; ECONOMIC COSTS; ELECTRICAL MEASUREMENT; HIGH CONDUCTIVITY; LOW RESISTIVITY; LOW TEMPERATURE BONDING; LOW TEMPERATURES; METALLIC BONDING; PACKAGING INDUSTRY; POLYVINYL PYRROLIDONE; PVP COATING;

NANOPARTICLES; SILVER; SINTERING;

BONDING;

EID: 80053524162 PISSN: 09599428 EISSN: 13645501 Source Type: Journal
DOI: 10.1039/c1jm12108a Document Type: Article

Times cited : (210)

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