Microstructure and electrical resistance evolution during sintering of a Ag nanoparticle paste

Journal of Physics D: Applied Physics

Volumn 48, Issue 14, 2015, Pages

  Scola, J ^a   Tassart, X ^a   Vilar, C ^a   Jomard, F ^a   Dumas, E ^b   Veniaminova, Y ^b   Boullay, P ^c   Gascoin, S ^c  

^a LABORATOIRE DES SCIENCES DU CLIMAT ET DE L ENVIRONNEMENT   (France)

^b UNIVERSITÉ DE VERSAILLES SAINT QUENTIN EN YVELINES   (France)

^c LABORATOIRE CRISMAT   (France)

Author keywords

electronic diffraction; high temperature electronics; lead free soldering; microstructure; silver nanoparticle paste

Indexed keywords

ELECTRIC RESISTANCE; ELECTRIC VARIABLES MEASUREMENT; LEAD-FREE SOLDERS; MASS SPECTROMETRY; MICROSTRUCTURE; NANOPARTICLES; SECONDARY ION MASS SPECTROMETRY; SINTERING; X RAY DIFFRACTION;

ELECTRICAL RESISTANCE MEASUREMENT; ELECTRICAL RESISTANCES; HIGH TEMPERATURE INTERCONNECTION; HIGH-TEMPERATURE ELECTRONICS; LEAD-FREE SOLDERING; MECHANICAL AND THERMAL PROPERTIES; SECONDARY ION MASS SPECTROSCOPY; SILVER NANOPARTICLE PASTES;

SILVER;

EID: 84925426394     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/48/14/145302     Document Type: Article

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