Low-temperature low-pressure die attach with hybrid silver particle paste

Microelectronics Reliability

Volumn 52, Issue 2, 2012, Pages 375-380

  Suganuma, K ^a   Sakamoto, S ^a   Kagami, N ^a   Wakuda, D ^a   Kim, K S ^a   Nogi, M ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AG NANOPARTICLE; AG PARTICLES; ALCOHOL SOLVENT; BOND LAYER; BONDING LAYERS; BONDING TEMPERATURES; DIE-ATTACH MATERIALS; DIRECT BONDED COPPERS; ELECTRICAL RESISTIVITY; LEAD-FREE; LOW TEMPERATURES; POROUS STRUCTURES; POWER SEMICONDUCTORS; SILVER PARTICLES; SUBMICRON-SIZED; THERMAL CYCLE;

DIES; ELECTRIC CONDUCTIVITY; HYBRID MATERIALS; POWER ELECTRONICS; SEMICONDUCTING SILICON COMPOUNDS; SILICON CARBIDE; SINTERING;

SILVER;

EID: 84855885291     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.07.088     Document Type: Article

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