3D integration review

Science China Information Sciences

Volumn 54, Issue 5, 2011, Pages 1012-1025

  Farooq, Mukta G ^a   Iyer, Subramanian S ^a  

^a IBM RESEARCH   (United States)

Author keywords

3D integration; Die stacking; Embedded memory; Through silicon via

Indexed keywords

EID: 79955856759     PISSN: 1674733X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11432-011-4226-7     Document Type: Review

References (78)

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