SCOPUS 정보 검색 플랫폼

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 373-378

3D integration-present and future

(2) Jiang, Tom a Luo, Shijian a

a MICRON TECHNOLOGY INC (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATIONS; ELECTRICAL INTERCONNECTIONS; ELECTRONIC DEVICES; FUTURE DIRECTIONS; HIGH DENSITIES; HIGH-SPEED; MASS PRODUCTIONS; MATERIALS AND PROCESS; SMALL SIZES; THIN WAFERS; THROUGH-SILICON-VIA; VIA DRILLINGS; VIA FILLINGS;

ELECTRONICS PACKAGING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

DIES;

EID: 63049103478 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/EPTC.2008.4763463 Document Type: Conference Paper

Times cited : (34)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.