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Volumn , Issue , 2007, Pages

Prediction of the influence of induced stresses in silicon on CMOS performance in a cu-through-Via interconnect technology

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; COPPER; FINITE ELEMENT METHOD; LARGE SCALE SYSTEMS; MICROPROCESSOR CHIPS; TRANSISTORS;

EID: 36349032313     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2007.360030     Document Type: Conference Paper
Times cited : (14)

References (14)
  • 1
    • 0032002771 scopus 로고    scopus 로고
    • Review of 3-D Packaging Technology
    • Said F. Al-Sarawi et al, "Review of 3-D Packaging Technology," IEEE Trans-CPMT-B, Vol. 21, No. 1 (1998)
    • (1998) IEEE Trans-CPMT-B , vol.21 , Issue.1
    • Al-Sarawi, S.F.1
  • 2
    • 28344452134 scopus 로고    scopus 로고
    • Demystifying 3D ICs: The Pros and Cons of Going Vertical
    • Rhett Davis W., et al, "Demystifying 3D ICs: The Pros and Cons of Going Vertical" IEEE Design and Test of Computers 2005
    • (2005) IEEE Design and Test of Computers
    • Rhett Davis, W.1
  • 5
    • 24644516719 scopus 로고    scopus 로고
    • Optimization for Chip Stack in 3-D Packaging
    • August
    • Hara K., et al "Optimization for Chip Stack in 3-D Packaging," IEEE Transactions on Advanced Paekaging-B, Vol 28, No. 3 August 2005. pp 367-376.
    • (2005) IEEE Transactions on Advanced Paekaging-B , vol.28 , Issue.3 , pp. 367-376
    • Hara, K.1
  • 10
    • 33846693940 scopus 로고
    • Piezoresistance Effect in Germanium and Silicon
    • April
    • Smith C.S., "Piezoresistance Effect in Germanium and Silicon " Physical Review Vol. 94, No.1, April 1954. pp 42-49.
    • (1954) Physical Review , vol.94 , Issue.1 , pp. 42-49
    • Smith, C.S.1
  • 11
    • 0000876593 scopus 로고
    • Nonlinear piezoresistance effects in Silicon
    • Feb
    • Matsuda K., et al "Nonlinear piezoresistance effects in Silicon" J Appl. Phys. Vol. 73, No. 4, Feb. 1993.
    • (1993) J Appl. Phys , vol.73 , Issue.4
    • Matsuda, K.1
  • 12
    • 33646043420 scopus 로고    scopus 로고
    • Uniaxial-Process-Induced Strained-Si: Extending the CMOS Roadmap
    • May
    • Thompson S. E., et al "Uniaxial-Process-Induced Strained-Si: Extending the CMOS Roadmap," IEEE Transactions on Electron Devices Vol 53, No. 5, May 2006.
    • (2006) IEEE Transactions on Electron Devices , vol.53 , Issue.5
    • Thompson, S.E.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.