Thermomechanical modeling of 3D electronic packages

IBM Journal of Research and Development

Volumn 52, Issue 6, 2008, Pages 623-634

  Sri Jayantha, Sri M ^a   McVicker, Gerard ^a   Bernstein, Kerry ^a   Knickerbocker, John U ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING;

ELECTRONIC PACKAGE; ELECTRONIC PACKAGING; INFORMED DECISION; MECHANICAL INTEGRITY; MECHANICAL PROBLEMS; MODEL COMMUNITIES; RESEARCH AND DEVELOPMENT; THERMOMECHANICAL MODEL;

FINITE ELEMENT METHOD;

EID: 61649098652     PISSN: 00188646     EISSN: 00188646     Source Type: Journal    
DOI: 10.1147/JRD.2008.5388568     Document Type: Article

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