Thermo-mechanical reliability analysis of 3D stacked-die packaging with through silicon via

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 102-107

  Chen, Zhaohui ^a   Song, Bin ^b   Wang, Xue Fang ^b,c   Liu, Sheng ^a,b,c  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^c HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATED THERMAL CYCLING TEST; ANALYSIS METHOD; CONFIGURATION PARAMETERS; CONTROL FACTORS; DIE PACKAGES; DIE PACKAGING; FATIGUE LIFE; FINITE ELEMENT SIMULATIONS; LAYER STRUCTURES; MODELING TECHNOLOGY; ORTHOGONAL ARRAY; ROBUST DESIGNS; SIMULATION RESULT; SOLDER JOINTS; TAGUCHI; THERMO-MECHANICAL; THERMOMECHANICAL RELIABILITY; THROUGH-SILICON-VIA; UNDERFILLS;

DESIGN OF EXPERIMENTS; DIES; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; PACKAGING; QUALITY ASSURANCE; THREE DIMENSIONAL;

RELIABILITY ANALYSIS;

EID: 78449285559     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5582479     Document Type: Conference Paper

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