A review of wafer bonding materials and characterizations to enable wafer thinning, backside processing, and laser dicing

2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Volumn , Issue , 2009, Pages

  Williams, G ^a   O'Hara, P ^a   Moore, J ^b   Gordon, B ^c   Rose, J ^d  

^a Ambios Technology Inc   (United States)

^b DAETEC LLC   (United States)

^c Materials Development Corporation   (United States)

^d Rose Consulting   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D PACKAGING; BONDED WAFERS; CHARACTERIZATION METHODS; CLEANING TESTS; CONTOUR MAPPING; GRINDING AND POLISHING; LASER DICING; MERCURY PROBE; METALLIZATIONS; ON-WAFER; PLANARIZATION; POLYMERIC SUBSTANCE; PRE-PROCESSING; PRODUCT QUALIFICATION; PURE MATERIALS; TGA AND DSC; THERMAL TESTS; THROUGH SILICON VIAS; TOTAL THICKNESS VARIATIONS; WAFER THINNING;

BONDING; CHARACTERIZATION; ELECTRONICS PACKAGING; GRINDING (MACHINING); MATERIALS; MERCURY (METAL); SILICON WAFERS; SILICONES; SURFACE ROUGHNESS; THREE DIMENSIONAL;

WAFER BONDING;

EID: 70549094118     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2009.5306571     Document Type: Conference Paper

References (4)

1. D. Mould, and J. Moore, A New Alternative for Temporary Wafer Mounting, GaAs MANTECH, Technical Digest, pp.109-112, April 2002.
2. J. Moore, A. Smith, D. Nguyen, and S. Kulkarni, High Temperature Resistant Adhesive for Wafer Thinning and Backside Processing, 2004 GaAs MANTECH, Technical Digest, pp. 175-178, May 2004.
3. A. Smith, J. Moore, and B. Hosse, A Chemical and Thermal Resistant Wafer Bonding Adhesive for Simplifying Wafer Backside Processing, GaAs MANTECH, Technical Digest, pp.269-271, April 2006.
4. U.S. Patent Applications 2009/0017248 A1 (2009), Larson et al.; 2009/0017323 A1 (2009), Webb et al.; and International Application WO 2008/008931 A1 (2008), Webb et al.