3D large scale integration technology using wafer-on-wafer (WOW) stacking

2010 IEEE International Interconnect Technology Conference, IITC 2010

Volumn , Issue , 2010, Pages

  Ohba, Takayuki ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRITICAL SCALING; HIGH-DENSITY INTEGRATION; LARGE SCALE INTEGRATION; MANUFACTURABILITY; ON-WAFER; THREE-DIMENSIONAL (3D); THROUGH-SILICON-VIA; WAFER STACKING; WAFER THINNING; WAFER-SCALE;

SILICON WAFERS; TECHNOLOGY; THREE DIMENSIONAL;

ELECTRONICS PACKAGING;

EID: 77955598987     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2010.5510747     Document Type: Conference Paper

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