3D Integration of electronics and mechanics

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 5-8

  Peltola, Tero ^a   Mansikkamäki, Pauliina ^b   Ristolainen, Eero O ^b  

^a Asperation Oy   (Finland)

^b TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS; PRINTED CIRCUIT BOARDS; PROCESS ENGINEERING; PRODUCT DESIGN; THERMOPLASTICS;

DESIGN FREEDOM; DESIGN PHASES; PROCESS MANAGEMENT; SYSTEM INTEGRATION;

ELECTRONICS INDUSTRY;

EID: 33746535508     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432035     Document Type: Conference Paper

References (5)

1. T. Peltola, P. Mansikkamäki and E.O. Ristolainen, "Effects of 3D Shapes in PWB Design" unpublished.
2. th IMAPS Nordic Annual Conference 2002, Stockholm, Sweden
3. europa.eu.int/comm/environment/waste/weee_index.htm [08.02.2005]
4. N. Heininger, J. Wolfgang, and H-J. Boßler, "Manufacturing of Molded Interconnected Devices from Prototyping to Mass Production with Laser Structuring", MID Conference 2004
5. C. Millsaps and J.C. Copeland, "Test Program Considerations for Portable Electronic Devices", Battery, Power Products & Technology Magazine, December 2002