TSV metrology and inspection challenges

2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Volumn , Issue , 2009, Pages

  Alapati, Ramakanth ^a   Travaly, Youssef ^b   Van Olmen, Jan ^b   Teixeira, Ricardo Cotrin ^b   Vaes, Jan ^b   Van Cauwenbergh, Marc ^b   Jourdain, Ann ^b   Verbinnen, Greet ^b   Marcuccilli, Gino ^a   Florence, Glenn ^a   Wolfling, Shay ^a   Pelissier, Christine ^a   Zhang, Haiping ^a   Sinha, Jaydeep ^a   Machura, Andreas ^a   Malik, Irfan ^a  

^a IMEC ^*  (United States)

^b KLA TENCOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D PACKAGING; CARRIER WAFERS; CHIP MANUFACTURERS; IN-CHIP; LARGE SIZES; NEW PROCESS; PROCESS DEVELOPMENT; PROCESS FLOWS; SIZE MEASUREMENTS; VIA-FIRST; WAFER INSPECTION;

BONDING; CHIP SCALE PACKAGES; INSPECTION; PROCESS MONITORING; SILICON CARBIDE; THREE DIMENSIONAL;

WAFER BONDING;

EID: 70549091102     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2009.5306573     Document Type: Conference Paper

References (1)

1. E. Beyne, "TSV Technology Overview", Semicon Taiwan 2008.