|
|
|
Volumn 53, Issue 2, 2010, Pages 10-12
|
|
Temporary bonding enables new processes requiring ultra-thin wafers
a
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
3D PACKAGING;
BACKGRINDING;
DEVICE CONFIGURATIONS;
LOWER COST;
MANUFACTURING CHALLENGES;
NEW OPTIONS;
NEW PROCESS;
PROCESSING STEPS;
SEMI-CONDUCTOR WAFER;
THINNING PROCESS;
ULTRA-THIN;
WAFER SUPPORT;
WAFER THICKNESS;
WIRELESS DEVICES;
CONSUMER ELECTRONICS;
ELECTRONIC EQUIPMENT MANUFACTURE;
GRINDING (MACHINING);
SILICON WAFERS;
WAFER BONDING;
|
|
EID: 77949729357
PISSN: 0038111X
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
|
Times cited : (7)
|
|
References (0)
|
