3D integration: Advantages, enabling technologies & applications

2010 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT 2010

Volumn , Issue , 2010, Pages 106-109

  Sadaka, Mariam ^a   Radu, Ionut ^b   Di Cioccio, Lea ^c  

^a SOITEC USA   (United States)

^b PARC TECHNOLOGIQUE DES FONTAINES   (France)

^c CEA LETI   (France)

Author keywords

3D advantages; 3D applications; 3D enabling technology; 3D integration

Indexed keywords

3D ADVANTAGES; 3D APPLICATION; 3D INTEGRATION; CONSUMER DEMANDS; ENABLING TECHNOLOGIES; FORM FACTORS; IMPROVED TECHNOLOGY; INTEGRATION SCHEME; MANUFACTURING CHALLENGES; MICROELECTRONIC INDUSTRY; MOORE'S LAW;

APPROXIMATION THEORY; COST REDUCTION; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUITS; INTEGRATION; MICROELECTRONICS; TECHNOLOGY;

THREE DIMENSIONAL;

EID: 77955620010     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICICDT.2010.5510283     Document Type: Conference Paper

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