Modeling fatigue behavior of electronically conductive adhesive joints under elevated temperature and humidity conditions

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

Volumn , Issue , 2004, Pages 14-26

  Gomatam, Rajesh R ^a   Sancaktar, Erol ^b  

^a Lehigh University   (United States)

^b University of Akron   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICALLY CONDUCTIVE ADHESIVES (ECA); ELEVATED TEMPERATURES; FATIGUE BEHAVIOR; STRESS RATIOS;

ATMOSPHERIC HUMIDITY; COMPUTER SIMULATION; COSTS; ELECTRIC CONDUCTIVITY; FATIGUE OF MATERIALS; PARAMETER ESTIMATION; RESIDUAL STRESSES; STRESS ANALYSIS; THERMAL CYCLING; THERMAL EFFECTS;

ADHESIVE JOINTS;

EID: 17044415313     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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