Moisture effects on the reliability of ACF interconnections

Electronics World

Volumn 111, Issue 1836, 2005, Pages 20-24

  Yin, Chunyan ^a   Lu, Hua ^a   Bailey, Chris ^a   Chan, Yan Cheong ^b  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC CONDUCTIVE FILMS (ACF); DISK DRIVES; DRIVER CHIPS; FLIP CHIP INTERCONNECTION;

ADHESIVES; ANISOTROPY; CONDUCTIVE FILMS; FLIP CHIP DEVICES; LIQUID CRYSTAL DISPLAYS; MICROPROCESSOR CHIPS; MOISTURE; SMART CARDS;

INTERCONNECTION NETWORKS;

EID: 27744502914     PISSN: 13654675     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (0)