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Volumn 34, Issue 11, 2005, Pages 1420-1427

Formulation and characterization of anisotropic conductive adhesive paste for microelectronics packaging applications

Author keywords

Anisotropic conductive adhesive (ACA); Failure analysis; Flip chip

Indexed keywords

ELECTRONICS PACKAGING; ETHERS; FAILURE ANALYSIS; FLIP CHIP DEVICES; MICROELECTRONICS; POLYMERS; RELIABILITY;

EID: 28044445714     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0200-8     Document Type: Article
Times cited : (15)

References (9)
  • 5
    • 28044461402 scopus 로고
    • ed. R.S. Bauer (Washington, D.C.: ACS Symposium Series 114, ACS)
    • W.A. Romanchick, J.E. Sohn, and J.F. Giebel, Epoxy Resin Chemistry, ed. R.S. Bauer (Washington, D.C.: ACS Symposium Series 114, ACS, 1979), pp. 341-358.
    • (1979) Epoxy Resin Chemistry , pp. 341-358
    • Romanchick, W.A.1    Sohn, J.E.2    Giebel, J.F.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.