|
Volumn 34, Issue 11, 2005, Pages 1420-1427
|
Formulation and characterization of anisotropic conductive adhesive paste for microelectronics packaging applications
|
Author keywords
Anisotropic conductive adhesive (ACA); Failure analysis; Flip chip
|
Indexed keywords
ELECTRONICS PACKAGING;
ETHERS;
FAILURE ANALYSIS;
FLIP CHIP DEVICES;
MICROELECTRONICS;
POLYMERS;
RELIABILITY;
ANISOTROPIC CONDUCTIVE ADHESIVE (ACA);
FLIP-CHIP;
ADHESIVES;
|
EID: 28044445714
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-005-0200-8 Document Type: Article |
Times cited : (15)
|
References (9)
|