Contact resistance and adhesion performance of ACF interconnections to aluminum metallization

Microelectronics Reliability

Volumn 43, Issue 8, 2003, Pages 1303-1310

  Zhang, J H ^a   Chan, Y C ^b   Alam, M O ^b   Fu, S ^a  

^a SHANGHAI UNIVERSITY   (China)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINUM; ANISOTROPY; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; METALLIZING; SURFACE PROPERTIES;

CONTACT RESISTANCE;

CONDUCTIVE FILMS;

EID: 0041663589     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00165-3     Document Type: Conference Paper

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