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Volumn , Issue , 2003, Pages 1701-1704

Microwave curing of anisotropic conductive film: Effects of principal parameters on curing situation

Author keywords

ACF; Curing time; DSC and SEM; FT IR

Indexed keywords

ANISOTROPY; CORROSION PREVENTION; CURING; ELECTRIC CONDUCTIVITY; MECHANICAL PROPERTIES; METALLIC FILMS; MICROWAVE HEATING; PHYSICAL PROPERTIES; PROTECTIVE COATINGS; SCANNING ELECTRON MICROSCOPY;

EID: 0037674308     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (4)

References (8)
  • 3
    • 0029406993 scopus 로고    scopus 로고
    • An overview of advances of conductive adhesive joining technology in electronics applications
    • Liu, J., An Overview of Advances of Conductive Adhesive Joining Technology in Electronics Applications, Materials Technology, Vol. 10, pp. 247-252
    • Materials Technology , vol.10 , pp. 247-252
    • Liu, J.1
  • 4
    • 0037607752 scopus 로고    scopus 로고
    • Anisotropic conductive adhesive films for flip-chip interconnection
    • In: Johan Liu (ed); Electrochemical Publications
    • Watanabe, I. and Takemura, K., Anisotropic Conductive Adhesive Films for Flip-Chip Interconnection. In: Johan Liu (ed) Conductive Adhesives for Electronics Packaging, Electrochemical Publications, pp. 256-271
    • Conductive Adhesives for Electronics Packaging , pp. 256-271
    • Watanabe, I.1    Takemura, K.2
  • 5
    • 0030212322 scopus 로고    scopus 로고
    • Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates
    • August
    • Lai, Z. and Liu, J., Anisotropically Conductive Adhesive Flip-Chip Bonding on Rigid and Flexible Printed Circuit Substrates, IEEE Transactions on Components, Packaging and Manufacturing Technology-Part B, Vol. 19, No. 3 August, pp. 644-660
    • IEEE Transactions on Components, Packaging and Manufacturing Technology-Part B , vol.19 , Issue.3 , pp. 644-660
    • Lai, Z.1    Liu, J.2
  • 6
    • 0032668194 scopus 로고    scopus 로고
    • Microwave curing of epoxy-amine system - Effect of curing agent on the rate enhancement
    • F. Y. C. Boey, B. H. Yap and L. Chia: Microwave curing of epoxy-amine system - effect of curing agent on the rate enhancement, Polymer Testing 18 (1999) pp93-109
    • (1999) Polymer Testing , vol.18 , pp. 93-109
    • Boey, F.Y.C.1    Yap, B.H.2    Chia, L.3
  • 7
    • 0026981621 scopus 로고
    • Basic ideas of microwave processing of polymers
    • 170-PMSE
    • Ward, T.C., Chen M. Basic ideas of microwave processing of polymers, Abstr Pap Am Chem Soc 1992, 203(part 3) 170-PMSE
    • (1992) Abstr Pap Am Chem Soc , vol.203 , Issue.PART 3
    • Ward, T.C.1    Chen, M.2
  • 8
    • 0026449728 scopus 로고    scopus 로고
    • Scale-up study of microwave heating of epoxy in tuneable cavities
    • Wei, J., Thomas, B., Hawley, M. C. Scale-up study of microwave heating of epoxy in tuneable cavities. 37th Int SAMPE Symp 1992, pp929-43
    • 37th Int SAMPE Symp 1992 , pp. 929-943
    • Wei, J.1    Thomas, B.2    Hawley, M.C.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.