Investigation of conductive adhesive bonding using UV curable anisotropic conductive adhesives at different curing conditions

Journal of Electronic Packaging

Volumn 127, Issue 1, 2005, Pages 52-58

  Lee, K K ^a   Tan, S C ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Curing Degree; FTIR; SEM; Shear Load; UV Curable ACAs

Indexed keywords

ATTENUATION; BONDING; CURING; DIELECTRIC MATERIALS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; SHEAR STRENGTH; SHRINKAGE; WINDING;

ANISOTROPIC CONDUCTIVE FILM (ACF); CURING DEGREE; SHEAR LOAD; UV CURABLE ACAS;

ADHESIVES;

EID: 18744366359     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1846068     Document Type: Article

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