Flip chip interconnect using anisotropic conductive adhesive

Journal of Materials Processing Technology

Volumn 89-90, Issue , 1999, Pages 484-490

  Sarkar, Gautam ^a   Mridha, S ^a   Chong, Tan Tin ^b   Tuck, Wu Yuen ^a   Kwan, Sem Chi ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE MATERIALS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; IMAGE ANALYSIS; MORPHOLOGY; PHYSICAL PROPERTIES; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS;

ANISOTROPIC CONDUCTIVE ADHESIVE; CHIP ON FLEX; FLIP CHIP INTERCONNECT; THERMOMECHANICAL ANALYSIS;

PLASTIC ADHESIVES;

EID: 0344240194     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(99)00136-3     Document Type: Article

References (11)

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