Application of adhesive bonding techniques in hard disk drive head assembly

Microelectronics Reliability

Volumn 42, Issue 4-5, 2002, Pages 767-777

  Luk, C F ^a   Chan, Y C ^b   Hung, K C ^b  

^a SAE Magnetics HK Ltd   (Hong Kong)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CONDUCTIVE FILMS; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MAGNETIC ANISOTROPY; MAGNETIC HEADS; MICROELECTRONIC PROCESSING; OPTIMIZATION;

ANISOTROPIC CONDUCTIVE FILM (ACF) BONDING; HARD DISK DRIVES (HDD);

HARD DISK STORAGE;

EID: 0036540856     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00038-0     Document Type: Article

References (6)

1. Adhesive flip chip bonding on flexible substrates
2. Anisotropic conductive adhesive file for flip-chip interconnection
3. Recent advances and evaluation of anisotropically conductive adhesives for microelectronics assembly
4. Models to determine guidelines for the anisotropic joining process
5. Manufacturability, reliability and failure mechanisms in conductive adhesive joining for flip-chip and surface mount applications