SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 32, Issue 3, 2003, Pages 131-136

Curing kinetics of anisotropic conductive adhesive film

(4) Chan, Y C a Uddin, M A a Alam, M O a Chan, H P a

a CITY UNIVERSITY OF HONG KONG (Hong Kong)

Author keywords

Anisotropic conductive adhesive film; Autocatalytic kinetic model; Curing; Glass transition temperature

Indexed keywords

ANISOTROPY; CALORIMETERS; CONDUCTIVE FILMS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; EPOXY RESINS; GLASS TRANSITION; RATE CONSTANTS; TEMPERATURE; THERMOSETS;

ANISOTROPIC CONDUCTIVE ADHESIVE FILM; ARRHENIUS EQUATION; AUTOCATALYTIC KINETIC MODEL; DIFFERENTIAL SCANNING CALORIMETER; THERMAL CURE PROCESS;

PLASTIC FILMS;

EID: 0037349426 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-003-0183-2 Document Type: Article

Times cited : (30)

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