Reliability of anisotropic conductive film joints using bumpless chip - Influence of reflow soldering and environmental testing

Journal of Electronic Packaging

Volumn 127, Issue 2, 2005, Pages 113-119

  Chiang, W K ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

ACF; Bumpless; Reflow; Reliability

Indexed keywords

ANISOTROPY; ATMOSPHERIC HUMIDITY; ELECTRONICS PACKAGING; ENVIRONMENTAL TESTING; FOURIER TRANSFORM INFRARED SPECTROSCOPY; MICROPROCESSOR CHIPS; OPTIMIZATION; PHYSICAL PROPERTIES; SCANNING ELECTRON MICROSCOPY; SOLDERING; THERMAL EFFECTS;

ADHESIVE JOINING; ANISOTROPIC CONDUCTIVE FILMS; ELECTRONIC APPLICATIONS; MECHANICAL CONTACTS;

CONDUCTIVE FILMS;

EID: 22944465424     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1849236     Document Type: Article

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