SCOPUS 정보 검색 플랫폼

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

Volumn , Issue , 2004, Pages 148-152

Analysis of influential factors in determining adhesive strength of ACF joints

(3) Inoue, M a Miyamoto, T a Suganuma, K a

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BINDERS; BONDING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; EPOXY RESINS; FRACTURE; JOINTS (STRUCTURAL COMPONENTS); LIQUID CRYSTAL DISPLAYS;

ADHESIVE STRENGTH; ANCHORING PATTERN; ANISOTROPIC CONDUCTIVE FILMS (ACF); GLASS SUBSTRATES;

CONDUCTIVE FILMS;

EID: 17044430216 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (3)

References (7)

1
- 0003512080
- Electrochemical Publications (Port Erin)
- J. Liu, Conductive adhesives for electronics packaging. Electrochemical Publications (Port Erin, 1999)
- (1999) Conductive Adhesives for Electronics Packaging
- Liu, J.¹

2
- 0037596762
- Conductive adhesives for electronic assemblies
- C.T. Murray, R.L. Rudman, M.B. Sabade and A.V. Pocius, "Conductive adhesives for electronic assemblies, MRS Bulletin, vol.28 (2003) pp.449-454
- (2003) MRS Bulletin , vol.28 , pp. 449-454
- Murray, C.T.¹ Rudman, R.L.² Sabade, M.B.³ Pocius, A.V.⁴

3
- 0036681696
- Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature
- Y. C. Chan and D. Y. Luk, "Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature", Microelectronics Reliability, vol.42 (2002) pp. 1185-1194
- (2002) Microelectronics Reliability , vol.42 , pp. 1185-1194
- Chan, Y.C.¹ Luk, D.Y.²

4
- 14844309683
- Effect curing condition of adhesion strength and ACA flip-chip contact resistance
- L. Cao, Z. Lai and J. Liu, "Effect curing condition of adhesion strength and ACA flip-chip contact resistance, Proc. HDP'04 (2004) pp.254-258
- (2004) Proc. HDP'04 , pp. 254-258
- Cao, L.¹ Lai, Z.² Liu, J.³

5
- 14844293521
- Relationship between curing conditions and interconnect properties of flexible printed circuit/glass substrate joints using anisotropic conductive films
- M. Inoue, T. Miyamoto and K. Suganuma, "Relationship between curing conditions and interconnect properties of flexible printed circuit/glass substrate joints using anisotropic conductive films", Proc. HDP'04 (2004) pp.248-253
- (2004) Proc. HDP'04 , pp. 248-253
- Inoue, M.¹ Miyamoto, T.² Suganuma, K.³

6
- 17044381381
- Effect of moisture absorption on the reliability of ACF interconnections between FPC and glass substrates
- M. Inoue, T. Miyamoto and K. Suganuma, "Effect of Moisture Absorption on the Reliability of ACF Interconnections Between FPC and Glass Substrates", Proc. ICEP2004 (2004) pp.212-216
- (2004) Proc. ICEP2004 , pp. 212-216
- Inoue, M.¹ Miyamoto, T.² Suganuma, K.³

7
- 0041663589
- Contact resistance and adhesion performance of ACF interconnections to aluminum metallization
- J.H. Zhang, Y.C. Chan, O. Alam and S. Fu, "Contact resistance and adhesion performance of ACF interconnections to aluminum metallization", Microelectronics Reliability, vol.43 (2003) pp.1303-1310
- (2003) Microelectronics Reliability , vol.43 , pp. 1303-1310
- Zhang, J.H.¹ Chan, Y.C.² Alam, O.³ Fu, S.⁴

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.