An experimental study of degradation of anisotropic conductive adhesive joints

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 946-952

  Lin, Y C ^a,b   Chen, Xu ^b   Wang, Z P ^c  

^a CENTRAL SOUTH UNIVERSITY   (China)

^b TIANJIN UNIVERSITY   (China)

^c Innovation Laboratory   (Netherlands)

Author keywords

Anisotropic conductive film; Chip On Glass (COG); FTIR; Hygrothermal aging

Indexed keywords

ADHESIVES; AGING OF MATERIALS; EPOXY RESINS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HYDROLYSIS; OXIDATION;

ANISOTROPIC CONDUCTIVE FILMS; CHIP-ON-GLASS (COG); HYGROTHERMAL AGING;

JOINTS (STRUCTURAL COMPONENTS);

EID: 33845582468     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645448     Document Type: Conference Paper

References (18)

1. S.O. Han and L.T. Drzal, "Water absorption effects on hydrophilic polymer matrix of carboxyl functionalized glucose resin and epoxy resin," European Polymer Journal, vol. 39, no. 9, pp. 1791-1799, 2003.
2. P. Wu and H.W. Siesler, "Water diffusion into epoxy resin: a 2D correlation ATR-FTIR investigation," Chemical Physics Letters, vol. 374, no. 1-2, pp. 74-78, 2003.
3. Y.C. Lin and Xu Chen, "Moisture sorption-desorption-resorption characteristics and its effect on the mechanical behavior of the epoxy system," Polymer, vol. 46, no. 25, pp. 11994-12003, 2005.
4. Y.C. Lin and Xu Chen, "Investigation of moisture diffusion in epoxy system: experiments and molecular dynamics simulations," Chemical Physics Letters, vol. 412, no. 4-6, pp. 322-326, 2005.
5. Y.C. Lin and Xu Chen, "Investigation of the effect of hygrothermal conditions on epoxy system by fractography and computer simulation," Materials Letters, vol. 59, no. 29-30, pp. 3831-3836, 2005.
6. S. Cotugno, G. Mensitieri, P. Musto and L. Sanguigno, "Molecular Interactions in and Transport Properties of Densely Cross-Linked Networks: A Time-Resolved FT-IR Spectroscopy Investigation of the Epoxy/H20 System," Macromolecules, vol. 38, no. 3, pp. 801-811, 2005.
7. Y. Li and H.J. Sue, "Moisture Diffusion Behavior in Bismaleimide Resin Subjected to Hygrothermal Cycling," Polymer Engineering Science, vol. 42, no. 2, pp. 375-381, 2002.
8. E.H. Wong and R. Rajoo, "Moisture absorption and diffusion characterisation of packaging materials-advanced treatment," Microelectronics Reliability, vol. 43, no. 12, pp. 2087-2096, 2003.
9. S.K. Karad, F.R. Jones and D. Attwood, "Moisture absorption by cyanate ester modified epoxy resin matrices. Part I. Effect of spiking parameters," Polymer, vol. 43, no. 19, pp. 5209-5218, 2002.
10. M.R. Vanlandingham, R.F. Eduljee and J.W. Gillespie Jr, "Moisture diffusion in epoxy systems," Journal of Applied Polymer Science, vol. 71, no. 5, pp. 787-798, 1999.
11. L. Banks, B. Ellis, "The glass transition temperatures of highly crosslinked networks: Cured epoxy resins," Polymer, vol. 23, no. 10, pp. 1466-1472, 1982.
12. E. Pretsch, P. Bühlmann and C. Affolter, Structure Determination of Organic Compounds: Tables of Spectral Data, Springer, New York, 2000.
13. R.M. Silverstein and F.X. Webster, Spectrometric Identification of Organic Compounds, Wiley, Canada, 1997.
14. Y. Li, J. Miranda and H.J. Sue, "Hygrothermal diffusion behavior in bismaleimide resin," Polymer, vol. 42, no. 18, pp. 7791-7799, 2001.
15. S.O. Han and L.T. Drzal, "Curing characteristics of carboxyl functionalized glucose resin and epoxy resin," European Polymer Journal, vol. 39, no. 7, pp. 1377-1384, 2003.
16. M. Davis and D Bond, "Principles and practices of adhesive bonded structural joints and repairs," International Journal of Adhesion and Adhesives, vol. 19, no. 1, pp. 91-105, 1999.
17. R. Balkova, S. Holcnerova and V. Cech, "Testing of adhesives for bonding of polymer composites," International Journal of Adhesion and Adhesives, vol. 22, no. 4, pp. 291-295, 2002.
18. M.A. Ansarifar, J. Zhang, J. Baker, A. Bell and R.J. Ellis, "Bonding properties of rubber to steel, aluminium and nylon 6,6," International Journal of Adhesion and Adhesives, vol. 21, no. 5, pp. 369-380, 2001.