Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip joints

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 3, 2000, Pages 447-451

  Pinardi, Kuntjoro ^b   Lai, Zonghe ^a,b,c   Vogel, Dietmar ^d   Kang, Yi Lan ^e   Liu, Johan ^a,b   Liu, Sheng ^a,f   Haug, Ralf ^g   Willander, Magnus ^a,b  

^a IEEE

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SWEREA IVF   (Sweden)

^d FRAUNHOFER IZM   (Germany)

^e TIANJIN UNIVERSITY   (China)

^f WAYNE STATE UNIVERSITY   (United States)

^g ROBERT BOSCH GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; CONDUCTIVE MATERIALS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); STRAIN; STRESS ANALYSIS; THERMAL CYCLING;

ANISOTROPICALLY CONDUCTIVE ADHESIVES (ACA);

FLIP CHIP DEVICES;

EID: 0034272306     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.868843     Document Type: Article

References (7)

1. Z. Lai, R. Lai, K. Persson, and J. Liu, "Effect of bump height on the reliability of ACA flip-chip joining with FR4 rigid and polyimide flexible substrate," J. Electron. Manufact., vol. 8, no. 3, 4, pp. 1-8, 1998.
2. J. Liu, "An overview of advances of conductive adhesive joining technology in electronics applications," Mater. Technol., vol. 10, pp. 247-252, 1995.
3. I. Watanabe and K. Takemura, "Anisotropic conductive adhesive films for flip-chip interconnection," in Conductive Adhesives for Electronics Packaging, J. Liu, Ed. London, U.K.: Electrochemical Publications Ltd., 1998.
4. M.-J. Yim, K. W. Paik, Y. K. Kim, and H. N. Hwang, "A study on the electrical conduction mechanism of anisotropically conductive film (ACF) for LCD packaging applications," in Advances in Electronic Packaging, New York: EEP, 1997, vol. 19-1, pp. 65-72.
5. M.-J. Yim, Y.-D. Jeon, and K.-W. Paik, "Electroless Ni bumped flip chip interconnections on an organic substrate using anisotropic conductive adhesives films (ACAs/ACF's)," in Extended Abstract in MAPS Work-shop on Flip Chip Technology. Atlanta, GA: IMAPS, Mar. 1999.
6. J. Liu, Y. L. Kang, S. Liu, and J. Liu, private communication.
7. J. H. Lau and Y.-H. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies. New York: McGraw-Hill, 1997.