Chip warpage damage model for ACA film type electronic packages

Key Engineering Materials

Volumn 297-300 II, Issue , 2005, Pages 887-892

  Yang, Se Young ^a   Kwon, Woon Seong ^a   Lee, Soon Bok ^a   Paik, Kyoung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Anisotropic conductive film; Chip warpage; Damage model; Delamination; Moir interferometry; Twyman green interferometry

Indexed keywords

ADHESIVES; ANISOTROPY; DELAMINATION; ELECTRONICS PACKAGING; INTERFEROMETRY; MICROPROCESSOR CHIPS; PRINTED CIRCUITS;

ANISOTROPIC CONDUCTIVE FILMS; ANISOTROPICALLY CONDUCTIVE ADHESIVES (ACA); CHIP WARPAGE; DAMAGE MODELS; MOIRÉ INTERFEROMETRY; TWYMAN-GREEN INTERFEROMETRY;

THIN FILMS;

EID: 34249740047     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-978-4.887     Document Type: Conference Paper

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