Resistance characterization of Au bump and anisotropic conductive adhesives under temperature and moisture conditions

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 420-425

  Lee, Charles ^a   Yeo, Alfred ^a  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; MOISTURE;

AU BUMP; JOINT RESISTANCE;

GOLD;

EID: 28444456396     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)

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