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Volumn 2006, Issue , 2006, Pages 1082-1087

Reliability analysis on epoxy based thermal interface subjected to moisture environment

Author keywords

Epoxy; Humidity; Reliability; Shear strength; Temperature; Thermal interface

Indexed keywords

ATMOSPHERIC HUMIDITY; ELECTRONICS PACKAGING; EPOXY RESINS; MOISTURE; RELIABILITY THEORY; SHEAR STRENGTH;

EID: 33845598597     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645465     Document Type: Conference Paper
Times cited : (2)

References (6)
  • 6
    • 33845562433 scopus 로고    scopus 로고
    • Package cooling designs for a dual-chip electronic package with one high power chip
    • A. Arvelo, et. al., "Package Cooling Designs for a Dual-Chip Electronic Package with One High Power Chip", Itherm04, 2004.
    • (2004) Itherm04
    • Arvelo, A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.