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Volumn 2006, Issue , 2006, Pages 1082-1087
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Reliability analysis on epoxy based thermal interface subjected to moisture environment
a
IBM
(United States)
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Author keywords
Epoxy; Humidity; Reliability; Shear strength; Temperature; Thermal interface
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Indexed keywords
ATMOSPHERIC HUMIDITY;
ELECTRONICS PACKAGING;
EPOXY RESINS;
MOISTURE;
RELIABILITY THEORY;
SHEAR STRENGTH;
METAL CARRIER;
THERMAL INTERFACE;
THERMAL RELIABILITY;
INTERFACES (MATERIALS);
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EID: 33845598597
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ITHERM.2006.1645465 Document Type: Conference Paper |
Times cited : (2)
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References (6)
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