A Continuous Contact Resistance Monitoring during the Temperature Ramp of Anisotropic Conductive Adhesive Film Joint

Journal of Electronic Materials

Volumn 33, Issue 1, 2004, Pages 14-21

  Uddin, M A ^a   Chan, Y C ^a   Chan, H P ^a   Alam, M O ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Anisotropic conductive adhesive film; Coefficient of thermal expansion; Flip chip; Glass transition temperature; High temperature contact resistance; Interfacial sliding

Indexed keywords

ANISOTROPY; BONDING; FLIP CHIP DEVICES; FLUXES; GLASS TRANSITION; HIGH TEMPERATURE EFFECTS; SCANNING ELECTRON MICROSCOPY; SWELLING; THERMAL EXPANSION; TOXICITY;

ANISOTROPIC CONDUCTIVE ADHESIVE FILM; COEFFICIENT OF THERMAL EXPANSION (CTE); HIGH-TEMPERATURE CONTACT RESISTANCE; INTERFACIAL SLIDING;

ADHESIVE JOINTS;

EID: 0742268462     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0288-2     Document Type: Article

References (17)

1. J.H. Constable, T. Kache, H. Teichmann, S. Muhle, and M.A. Gaynes, IEEE Trans. Comp. Packaging Technol. 22, 191 (1999).
2. M.A. Uddin, M.O. Alam, Y.C. Chan, and H.P. Chan, J. Electron. Mater. 32, 1117 (2003).
3. M.A. Uddin, M.O. Alam, Y.C. Chan, and H.P. Chan, Microelectron. Reliab., accepted for publication.
4. S.M. Chang, J.H. Jou, A. Hsieh, T.H. Chen, C.Y. Chang, Y.H. Wang, and C.M. Huang, Microelectron. Reliab. 41, 2001 (2001).
5. L. Frisk, J. Jarvinen, and R. Ristolainen, Microelectron. Reliab. 42, 1559 (2002).
6. A. Seppala, T. Allinniemi, and E. Ristolainen, Microelectron. Reliab. 42, 1547 (2002).
7. J.D. Weidler, R.D. Burg, J.J. Decker, and J.H. Constable, 50th Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2000), pp. 906-913.
8. K.D. Kim and D.D.L. Chung, J. Electron. Mater. 31, 933 (2002).
9. Y.C. Chan, M.A. Uddin, M.O. Alam, and H.P. Chan, J. Electron. Mater. 32, 131 (2003).
10. C.Y. Yin, M.O. Alam, Y.C. Chan, C. Bailey, and H. Lu, Microelectron. Reliab. 43, 625 (2003).
11. V. Gektin and A. Bar-Cohen, IEEE Circuits Dev. 14, 29 (1998).
12. Z. Lai, R. Lai, K. Persson, and J. Liu, J. Electron. Manufacturing 8, 217 (1998).
13. S.M. Chang, J.H. Jou, A. Hsieh, T.H. Chen, J.N. Jao, and H.S. Wu, IEEE Trans. Comp. Packaging Technol. 24, 493 (2001).
14. B. Stone, J.M. Czarnowski, and J.R. Guajardo, 51st Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2001), pp. 997-1002.
15. M.J. Yim, Y.D. Jeon, and K.W. Paik, IEEE Trans. Electron. Packaging Manufacturing 23, 171 (2000).
16. S.H. Fan and Y.C. Chan, J. Electron. Mater. 32, 101 (2003).
17. L. Ali, Y.C. Chan, and M.O. Alam, Solder. Surf. Mount Technol., submitted for publication.