Electrical conductive characteristics of anisotropic conductive adhesive particles

Journal of Electronic Packaging

Volumn 125, Issue 4, 2003, Pages 609-616

  Dou, G B ^a   Chan, Y C ^a   Liu, Johan ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; DEFORMATION; ELECTRIC CONDUCTORS; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; GOLD; INTERFACES (MATERIALS); NICKEL; PARTICLES (PARTICULATE MATTER); PHASE TRANSITIONS; THICKNESS MEASUREMENT;

ANISOTROPIC CONDUCTIVE ADHESIVE PARTICLES; CHIP BUMPS; FINE PITCH ELECTRONIC PACKAGING; PARTICLE TRANSFORMATION FACTOR;

ELECTRIC CONDUCTIVITY;

EID: 0347567445     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1604808     Document Type: Article

References (6)

1. Dudek, Rainer, Meinel, Stefan, and Schubert, Andreas, 1999, "Flow Characterization and Thermo-Mechanical Response of Anisotropic Conductive Films," IEEE Transactions On Components and Packaging Technology, 22, pp. 177-185.
2. Liu, Johan, 1999, Conductive Adhesive for Electronics Packaging, Electrochemical Publication Ltd., London, UK.
3. Fu, Ying, Willander, Magnus, and Liu, Johan, 2001, "Statistics of Electric Conductance Through Anisotropically Conductive Adhesive," IEEE Transactions On Components and Packaging Technology, 24, pp. 250-255.
4. Yim, Myung-Jin, and Paik, Kyung-Wook, 2001, "The Contact Resistance and Reliability of Anisotropically Conductive Film (ACF)," IEEE Trans. Adv. Packag., 22, pp. 166-173.
5. Fu, Ying, Wang, Yanli, Wang, Xitao, Liu, Johan, Lai, Zhaohe, Chen, Guoliang, and Willandaer, Magnus, 2000, "Experimental and Theoretical Characterization of Electrical Contact in Anisotropically Conductive Adhesive," IEEE Trans. Adv. Packag., 23, pp. 15-21.
6. Shiozawa, N., Isaka, K., and Ohta, T., 1995, "Electric Properties of Connections by Anisotropic Conductive Film," Journal of Electronics Manufacturing, 5, pp. 33-37.