Moisture-induced failures of adhesive flip chip interconnects

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 3, 2005, Pages 506-516

  Teh, L K ^a   Teo, Mary ^a,b   Anto, Edi ^a,c   Wong, C C ^a   Mhaisalkar, S G ^a   Teo, Poi Siong ^d   Wong, E Hua ^d  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

^c STMICROELECTRONICS   (Singapore)

^d INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Adhesive interconnection; Anisotropic conductive adhesives; Coefficient of moisture expansion; Flip chip; Moisture; Nonconductive adhesives

Indexed keywords

ADHESION; ADHESIVES; DELAMINATION; FAILURE ANALYSIS; MOISTURE; RELIABILITY; SENSITIVITY ANALYSIS;

ADHESIVE INTERCONNECTION; ANISOTROPIC CONDUCTIVE ADHESIVES; COEFFICIENT OF MOISTURE EXPANSION; NONCONDUCTIVE ADHESIVES;

FLIP CHIP DEVICES;

EID: 27644508040     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848572     Document Type: Article

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