High-density interconnections in mobile phones using ACF

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

Volumn , Issue , 2004, Pages 99-104

  Savolainen, Petri ^a   Saarinen, Ilkka ^a   Rusanen, Outi ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COMPUTER HARDWARE; COSTS; ENERGY UTILIZATION; INTEGRATED CIRCUITS; PHOTOGRAPHY; RELIABILITY; THERMAL CYCLING;

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); ANISOTROPICALLY CONDUCTIVE FILMS (ACF); HIGH-DENSITY INTERCONNECTIONS; MOBILE PHONES;

MOBILE TELECOMMUNICATION SYSTEMS;

EID: 17044409686     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. I. Watanabe, K. Takemura, "Anisotropic conductive adhesive films for flip-chip interconnection", in Liu, J. (ed.), Conductive Adhesives for Electronics Packaging, Electrochemical Publications (Isle of Man, 1999), pp 256-271.