Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 855-860

  Rizvi, M J ^a   Bailey, C ^a   Chan, Y C ^b   Lu, H ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Anisotropic conductive film (ACF); Chip on flex (COF); Conductive particle; Contact resistance; Finite element modelling; Life time; Stress

Indexed keywords

COMPUTER SIMULATION; CONDUCTIVE FILMS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; SCANNING ELECTRON MICROSCOPY; SOLDERING;

ANISOTROPIC CONDUCTIVE FILM (ACF); CHIP-ON-FLEX (COF); CONDUCTIVE PARTICLE; CONTACT RESISTANCE; LIFE-TIME;

THERMAL CYCLING;

EID: 33845572333     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645436     Document Type: Conference Paper

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