Development of ontology for the anisotropic conductive adhesive interconnect technology in electronics applications

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 193-208

  Liu, Johan ^a,b   Wang, Yu ^a   Morris, James ^c   Kristiansen, Helge ^d  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SHANGHAI UNIVERSITY   (China)

^c Portland State University   (United States)

^d Mosaic Solutions AS and Conpart AS   (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; ELECTRONIC EQUIPMENT; INTEGRATED CIRCUITS; OPTIMIZATION; PROCESS CONTROL; RELIABILITY;

ELECTRONIC COMPONENTS; ELECTRONICS APPLICATIONS; ELECTRONICS HARDWARE;

ELECTRONICS ENGINEERING;

EID: 33746554327     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432076     Document Type: Conference Paper

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