Failure Mechanism Study of Anisotropic Conductive Film (ACF) Packages

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 3, 2003, Pages 509-516

  Mercado, Lei L ^a   White, Jerry ^a   Sarihan, Vijay ^a   Lee, Tien Yu Tom ^a  

^a MOTOROLA INC   (United States)

Author keywords

ACF packages; Anisotropic conductive film; Delamination; Failure mechanism; Fine pitch; Finite element simulation; Flip chip; Material selection; Moisture preconditioning; Reliability

Indexed keywords

ELECTRIC CONTACTS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTERFACES (MATERIALS);

MOISTURE PRECONDITIONING;

CONDUCTIVE FILMS;

EID: 0142165077     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.817640     Document Type: Article

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