Recent advances on Electrical Conductive Adhesives (ECAs)

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

Volumn , Issue , 2004, Pages 1-7

  Li, Yi ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); BALL GRID ARRAYS (BGA); ELECTRICAL CONDUCTIVE ADHESIVES (ECA); PRINTED WIRING BOARDS (PWB);

ANISOTROPY; BONDING; ELECTRIC CONDUCTIVITY; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTRONIC EQUIPMENT; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTEGRATED CIRCUITS; MICROELECTRONICS; SOLDERING;

ADHESIVES;

EID: 17044395941     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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