Effect of bonding force on the conducting particle with different sizes

Journal of Electronic Packaging

Volumn 125, Issue 4, 2003, Pages 624-629

  Yeung, N H ^a   Chan, Y C ^a   Tan, C W ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; COMPUTER SIMULATION; CONDUCTIVE MATERIALS; CRACKS; DEFORMATION; FINITE ELEMENT METHOD; HEAT TRANSFER; PARTICLES (PARTICULATE MATTER); STRESS ANALYSIS; STRESS CONCENTRATION;

ANISOTROPIC CONDUCTIVE ADHESIVE; BONDING FORCE; MECHANICAL STRESS ANALYSIS;

BONDING;

EID: 0346936423     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1604810     Document Type: Article

References (12)

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