Effect of bump height on the reliability of ACA flip chip joining with FR4 rigid and polyimide flexible substrate

Journal of Electronics Manufacturing

Volumn 8, Issue 3, 1998, Pages 217-224

  Lai, Zonghe ^a   Lai, Ruoyin ^a   Persson, Katrin ^a   Liu, Johan ^a  

^a Swed Inst of Prod Eng Research   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CONDUCTIVE MATERIALS; ELECTRONICS PACKAGING;

ANISOTROPICALLY-CONDUCTIVE ADHESIVES (ACA);

FLIP CHIP DEVICES;

EID: 0032274513     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/s0960313198000203     Document Type: Article

References (8)

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3. Z. Lai and J. Liu, "Anistropically conductive adhesive flip chip bonding on rigid and flexible printed circuit substrate", IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B 19(3) (1996), 644-660.
4. S. H. Mannan, C. N. Oguibe, D. C. Whalley and D. J. Williams, "Effect of gap height on conduction within anisotropic conducting adhesive assemblies", J. Elect. Manuf. 7(3) (1997), 211-224.
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7. R. Satoh, "A prediction of the thermal fatigue life of solder joints using crack propagation rate and equivalent strain range", in Thermal Stress and Strain in Microelectronics Packaging, ed. John H. Lau, Van Nostrand Reinhold, New York, 1993, pp. 500-531.
8. E. A. Brandes and G. B. Brook, (eds.), Smithells Metals Reference Book, 7th edition, Butterworth-Heinemann, Oxford, 1998.