The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications

Microelectronics Reliability

Volumn 43, Issue 4, 2003, Pages 625-633

  Yin, C Y ^a   Alam, M O ^a   Chan, Y C ^a   Bailey, C ^b   Lu, Hua ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CHEMICAL BONDS; CONDUCTIVE FILMS; ELECTRIC CONDUCTIVITY; MICROPROCESSOR CHIPS;

CONTACT RESISTANCE;

THIN FILMS;

EID: 0037381421     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00348-7     Document Type: Article

References (10)

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