Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation

Journal of Electronic Packaging

Volumn 127, Issue 2, 2005, Pages 86-90

  Kwon, Woon Seong ^a   Yim, Myung Jin ^a   Paik, Kyung Wook ^a   Ham, Suk Jin ^b   Lee, Soon Bok ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Anisotropic Conductive Adhesive Joint; Delamination; Moir Interferometry; Thermal Cycling Reliability; Thermal Deformation

Indexed keywords

ANISOTROPY; DEFORMATION; DELAMINATION; FLIP CHIP DEVICES; INTERFEROMETRY; NONDESTRUCTIVE EXAMINATION; PHOTOMECHANICS; SUBSTRATES; THERMAL CYCLING; THERMAL EXPANSION;

ANISOTROPIC CONDUCTIVE ADHESIVE JOINTS; MOIRE INTERFEROMETRY; THERMAL CYCLING RELIABILITY; THERMAL DEFORMATION;

ADHESIVES;

EID: 22944446769     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1846062     Document Type: Article

References (7)

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