Research on the interfacial reaction between anisotropically conductive film and bumpless die

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1569-1574

  Zhang, J H ^a   Chan, Y C ^a   Zeng, Z M ^a   Chiu, Y W ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Adhesion; Aluminum; Anisotropically conductive film (ACF); Bumpless die; Interfacial reaction

Indexed keywords

ADHESION; ANISOTROPY; BONDING; DELAMINATION; DIES; GLASS; INTERFACES (MATERIALS); OXIDATION; SCANNING ELECTRON MICROSCOPY; SURFACE CHEMISTRY; SWELLING; X RAY PHOTOELECTRON SPECTROSCOPY;

ANISOTROPICALLY CONDUCTIVE FILMS (ACF); BUMPLESS DIE;

CONDUCTIVE FILMS;

EID: 0036287839     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

1. The contact resistance and reliability of anisotropically conductive film (ACF)
2. Electrical characteristics of an ACF bond as a function of temperature and humidity aging
3. Mechanisms underlying the unstable contact resistance of conductive adhesives
4. Electrically conductives: A prospective alternative for SMD soldering?
5. Evaluation of contact resistance for isotropic electrically conductive adhesives
6. Feasibility of surface activated bonding for ultra-fine pitch interconnection - A new concept of bump-less direct bonding for system level packaging
7. Bump-less interconnect for next generation system packaging
8. Room-temperature direct bonding of CMP-Cu film fro bumpless interconnection
9. A new approach to using anisotropically conductive adhesives for flip-chip assembly
10. Conductive adhesive flip-chip bonding for bumped and unbumped die
11. Influence of temperature and humidity on adhesion of underfills for flip chip packaging
12. Chemical kinetic model of interracial degradation of adhesive joints
13. The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging